Comparison ledger
ABM -407B-2-S-CE-S293 Robot, Ulvac Phi Adept 1010 Automated Depth Profiling, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | ||
|---|---|---|
| OEM | ABM | Ulvac |
| Category | — | — |
| Wafer size | — | — |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | ABM -407B-2-S-CE-S293 Robot | Ulvac Phi Adept 1010 Automated Depth Profiling |
| Specifications | ||
| Model | ABM-407B-2-S-CE-S293[1] | Phi Adept 1010[2] |
| Description | ROBOT[1] | — |
| Refurbished RTP RTA | AG Associates 4100, 4108, 8108, 8800, 8800i,210, 310, 410, 610, 610I, MPT RTP-600S, 800S, RTP-3000[1] | — |
| KLA-Tencor Spare Parts and Service | RS-35C,RS-55,RS-75,RS-100,UV-1050,UV-1080,UV-1250,UV-1280,ASET F5 / F5X,AIT Systems,HRP-220 Stylus Profiler[1] | — |
| Refurbished Isotropic Plasma Etcher | Matrix, Tegal, Lam Research, Branson/IPC, PlasmaTherm[1] | — |
| Refurbished PECVD, ALD Equipment | Cambridge, Oxford PlasmaLab , Plasma-Therm, STS/SPTS, AMAT[1] | — |
| Refurbished Mask Aligner | Canon Neutronix PLA501/545, Suss MA200CC, MA8BA8 GEN3, MA8BA8 GEN2, MA8BA8, MA200E[1] | — |
| Refurbished Bonding | SUSS SB6E, SUSS SB8E, EVG 620 BA, EVG EV501, West Bond 7200AR 7400A[1] | — |
| Refurbished Wafer Prober | Electroglas EG 4090u+, EG 4090, EG 2001X, EG 1034X, Cascade PS-21[1] | — |
| Manufacturer | — | Ulvac[2] |
| Instrument type | — | Quadrupole dynamic secondary ion mass spectrometer (SIMS)[3] |
| Primary beam energy range | — | 0.25–11 keV[4] |
| Mass range | — | 1–340 amu[4] |
| Net weight | — | 1,350 kg[3] |
| Shipping weight | — | ~2,400 kg[3] |
| Power supply | — | 200–230 V AC, 50/60 Hz, 50 A (single-phase)[3] |
| Operating temperature | — | 20°C ± 3°C[3] |
| Relative humidity | — | <50%[3] |