Comparison ledger
ABM -407B-2-S-CE-S293 Robot, Takatori ATM 8100 S, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | ATM 8100 STakatori | |
|---|---|---|
| OEM | ABM | Takatori |
| Category | — | — |
| Wafer size | — | — |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | ABM -407B-2-S-CE-S293 Robot | Takatori ATM |
| Specifications | ||
| Model | ABM-407B-2-S-CE-S293[1] | — |
| Description | ROBOT[1] | — |
| Refurbished RTP RTA | AG Associates 4100, 4108, 8108, 8800, 8800i,210, 310, 410, 610, 610I, MPT RTP-600S, 800S, RTP-3000[1] | — |
| KLA-Tencor Spare Parts and Service | RS-35C,RS-55,RS-75,RS-100,UV-1050,UV-1080,UV-1250,UV-1280,ASET F5 / F5X,AIT Systems,HRP-220 Stylus Profiler[1] | — |
| Refurbished Isotropic Plasma Etcher | Matrix, Tegal, Lam Research, Branson/IPC, PlasmaTherm[1] | — |
| Refurbished PECVD, ALD Equipment | Cambridge, Oxford PlasmaLab , Plasma-Therm, STS/SPTS, AMAT[1] | — |
| Refurbished Mask Aligner | Canon Neutronix PLA501/545, Suss MA200CC, MA8BA8 GEN3, MA8BA8 GEN2, MA8BA8, MA200E[1] | — |
| Refurbished Bonding | SUSS SB6E, SUSS SB8E, EVG 620 BA, EVG EV501, West Bond 7200AR 7400A[1] | — |
| Refurbished Wafer Prober | Electroglas EG 4090u+, EG 4090, EG 2001X, EG 1034X, Cascade PS-21[1] | — |
| Configuration | — | Non-operational[2] |
| Machine type | — | Automatic Wafer Mounter[3] |
| Application | — | Mounting wafers to dicing frames before the dicing process[3] |
| Throughput | — | 80 wafers/h[3] |
| Wafer size | — | 6 inch; 8 inch[3] |
| Frame size | — | 6 inch W 230mm; 8 inch W 300mm[3] |
| Tape width | — | 6 inch W 230mm; 8 inch W 300mm[3] |
| Utilities | — | AC200V single phase 50/60Hz; 3.0KVA; Pressure 0.5Mpa; 300Nl/min using venturi valve[3] |
| Dimensions | — | D 1,200 W 1,646 H 1,800mm[3] |
| Weight | — | 850kg[3] |
| Options | — | ID reader; Barcode labeller[3] |
| Feature | — | Mounting minimum 150-micron thick and max 5 mm-warped wafers[4] |
| Vintage | — | 1998 Vintage[5] |
| Power & electrical | — | AC200V single phase 50/60Hz; 3.0KVA; Pressure 0.5Mpa; 300Nl/min using venturi valve[5] |
| Mounting minimum | — | 150-micron thick and max 5 mm-warped wafers[4] |