Comparison ledger
ABM -407B-2-S-CE-S293 Robot, SVG 8800, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | 8800SVG | |
|---|---|---|
| OEM | ABM | SVG |
| Category | — | — |
| Wafer size | — | — |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | ABM -407B-2-S-CE-S293 Robot | SVG 8800 |
| Cited variants | — | |
| Specifications | ||
| Model | ABM-407B-2-S-CE-S293[3] | 8800[5] |
| Description | ROBOT[3] | — |
| Refurbished RTP RTA | AG Associates 4100, 4108, 8108, 8800, 8800i,210, 310, 410, 610, 610I, MPT RTP-600S, 800S, RTP-3000[3] | — |
| KLA-Tencor Spare Parts and Service | RS-35C,RS-55,RS-75,RS-100,UV-1050,UV-1080,UV-1250,UV-1280,ASET F5 / F5X,AIT Systems,HRP-220 Stylus Profiler[3] | — |
| Refurbished Isotropic Plasma Etcher | Matrix, Tegal, Lam Research, Branson/IPC, PlasmaTherm[3] | — |
| Refurbished PECVD, ALD Equipment | Cambridge, Oxford PlasmaLab , Plasma-Therm, STS/SPTS, AMAT[3] | — |
| Refurbished Mask Aligner | Canon Neutronix PLA501/545, Suss MA200CC, MA8BA8 GEN3, MA8BA8 GEN2, MA8BA8, MA200E[3] | — |
| Refurbished Bonding | SUSS SB6E, SUSS SB8E, EVG 620 BA, EVG EV501, West Bond 7200AR 7400A[3] | — |
| Refurbished Wafer Prober | Electroglas EG 4090u+, EG 4090, EG 2001X, EG 1034X, Cascade PS-21[3] | — |
| Configuration | — | Dual Coat with soft bake[1] |
| Type | — | Single-track coater and developer[4] |
| Wafer size | — | 6 inch[5] |
| Spindle acceleration | — | Up to 50,000 RPM/second[4] |
| Programmable dispense arm | — | Yes[4] |
| Automatic cassette wafer handling | — | Yes, dual load and unload[4] |
| Edge bead removal | — | Top nozzle[4] |
| Backside rinse | — | Bottom nozzle[4] |
| Hot plate temperature range | — | Up to 300 °C[4] |
| Developer dispense type | — | Pressurized nozzle[4] |
| Developer mode | — | Dynamic or static[4] |
| Developer rinse | — | DI water rinse[4] |
| Coater/Developer type | — | Photoresist coating and developing[4] |
| Spindle Motor Acceleration | — | 50,000 RPM/second[4] |
| Edge Bead Removal | — | Top nozzle for EBR[4] |
| Backside Rinse | — | Bottom nozzle for backside rinse[4] |
| Developer Type | — | Single track with pressurized dispense nozzle[4] |
| Cassette Handling | — | Automatic with dual load and unload[4] |
| Supported Wafer Size | — | 6 inch[5] |
| OEM | — | SVG[5] |
| Equipment type | — | Coater / Developer[5] |
| Operating mode | — | Single track dispense photoresist spinner[4] |
| Cassette handling | — | Automatic cassette wafer handling with dual load and unload capability[4] |
| Dispense arm | — | Programmable dispense arm motion[4] |
| EBR | — | Top nozzle for Edge Bead Removal[4] |
| Hot plate oven | — | Programmable up to 300 C[4] |