Comparison ledger
ABM -407B-2-S-CE-S293 Robot, KLA RS 100, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | RS 100KLA | |
|---|---|---|
| OEM | ABM | KLA |
| Category | — | — |
| Wafer size | — | — |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | ABM -407B-2-S-CE-S293 Robot | KLA RS 100 |
| Specifications | ||
| Model | ABM-407B-2-S-CE-S293[1] | — |
| Description | ROBOT[1] | — |
| Refurbished RTP RTA | AG Associates 4100, 4108, 8108, 8800, 8800i,210, 310, 410, 610, 610I, MPT RTP-600S, 800S, RTP-3000[1] | — |
| KLA-Tencor Spare Parts and Service | RS-35C,RS-55,RS-75,RS-100,UV-1050,UV-1080,UV-1250,UV-1280,ASET F5 / F5X,AIT Systems,HRP-220 Stylus Profiler[1] | — |
| Refurbished Isotropic Plasma Etcher | Matrix, Tegal, Lam Research, Branson/IPC, PlasmaTherm[1] | — |
| Refurbished PECVD, ALD Equipment | Cambridge, Oxford PlasmaLab , Plasma-Therm, STS/SPTS, AMAT[1] | — |
| Refurbished Mask Aligner | Canon Neutronix PLA501/545, Suss MA200CC, MA8BA8 GEN3, MA8BA8 GEN2, MA8BA8, MA200E[1] | — |
| Refurbished Bonding | SUSS SB6E, SUSS SB8E, EVG 620 BA, EVG EV501, West Bond 7200AR 7400A[1] | — |
| Refurbished Wafer Prober | Electroglas EG 4090u+, EG 4090, EG 2001X, EG 1034X, Cascade PS-21[1] | — |
| Wafer size range | — | 2 to 12 inch[2] |
| Measurement type | — | Sheet resistance (four-point probe)[2] |
| Measurement range | — | >5 mΩ/sq to <5 MΩ/sq[2] |
| Absolute accuracy | — | ±1% of certified value (NIST traceable, corrected to 23°C)[2] |
| Measurement repeatability | — | <0.2% (1σ) at 1σ test diameter with appropriate probe head[2] |
| Reproducibility (metals) | — | <0.5% for Cu, W, TiN[2] |
| Edge exclusion | — | 1 mm from edge of conductive film[2] |
| Sites programmable (routine) | — | 1 to 30 sites (ASTM standard tests included)[2] |
| Sites programmable (mapping) | — | Up to 1,200 sites (XY maps and user-defined patterns)[2] |
| Wafer loading | — | Manual, open cassette (200/300mm)[2] |
| Wafer aligner | — | High-speed, on-stage optical aligner with CCD and ring illuminator[2] |
| Probe head types | — | Type A, B, C, D, E, F, H (one precision probe head)[2] |
| Computer system | — | Pentium III with keyboard and trackball[2] |
| Operating system | — | Windows NT[2] |
| Software version | — | 2.31[2] |
| AC voltage | — | 200–240 VAC[2] |
| Vacuum requirement | — | Min 25 inHg[2] |
| Air supply | — | 80–100 PSI[2] |