Comparison ledger
ABM -407B-1-S-CES293 Robot, Disco DCS1440, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | DCS1440Disco | |
|---|---|---|
| OEM | ABM | Disco |
| Category | — | — |
| Wafer size | — | 100mm |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | ABM -407B-1-S-CES293 Robot | Disco DCS1440 |
| Specifications | ||
| Model | ABM-407B-1-S-CES293[1] | — |
| Description | ROBOT[1] | — |
| Refurbished RTP RTA | AG Associates 4100, 4108, 8108, 8800, 8800i,210, 310, 410, 610, 610I, MPT RTP-600S, 800S, RTP-3000[1] | — |
| KLA-Tencor Spare Parts and Service | RS-35C,RS-55,RS-75,RS-100,UV-1050,UV-1080,UV-1250,UV-1280,ASET F5 / F5X,AIT Systems,HRP-220 Stylus Profiler[1] | — |
| Refurbished Isotropic Plasma Etcher | Matrix, Tegal, Lam Research, Branson/IPC, PlasmaTherm[1] | — |
| Refurbished PECVD, ALD Equipment | Cambridge, Oxford PlasmaLab , Plasma-Therm, STS/SPTS, AMAT[1] | — |
| Refurbished Mask Aligner | Canon Neutronix PLA501/545, Suss MA200CC, MA8BA8 GEN3, MA8BA8 GEN2, MA8BA8, MA200E[1] | — |
| Refurbished Bonding | SUSS SB6E, SUSS SB8E, EVG 620 BA, EVG EV501, West Bond 7200AR 7400A[1] | — |
| Refurbished Wafer Prober | Electroglas EG 4090u+, EG 4090, EG 2001X, EG 1034X, Cascade PS-21[1] | — |
| Mentioned function | — | atomizing cleaning[2] |
| Associated equipment | — | DAG810 automatic surface grinder[2] |
| Maximum workpiece size | — | Φ8 inch[3] |
| Application frame | — | 2-8-1[4] |
| Table RPM | — | 100 to 3,000 min⁻¹[3] |
| Setting time for cleaning/drying | — | 0 to 999 sec[3] |
| Cleaning nozzle speed | — | 1 to 37.5 °/sec[3] |
| Cleaning range | — | Φ365 mm (up to 250×250 mm)[3] |
| Cleaning pressure range | — | 2.3 to 11.8 MPa[3] |
| Equipment dimensions (W×D×H) | — | 400 × 600 × 1,220 mm[3] |
| Dry mass | — | Approx. 124 kg[3] |
| Maximum square workpiece (optional) | — | 250×250 mm[3] |